Thick epoxy resist sheets for MEMS manufactuing and packaging

Author

Johnson, Don ; Voigt, Anja ; Ahrens, Gisela ; Dai, Wen

Author_Institution

DJ DevCorp, Wayland, MA, USA

fYear

2010

fDate

24-28 Jan. 2010

Firstpage

412

Lastpage

415

Abstract

We describe a new line of SUEX thick epoxy resist sheets which are pre-cut to substrate dimensions and can be made to thicknesses of 100Â¿m to more than 1mm. The sheets need only to be laminated to a substrate surface and are ready to use in minutes. We will describe the preliminary results of our developmental antimony-free thick dry film epoxy sheets (TDFS) for consideration as a next generation multi-purpose MEMS material. SUEX sheets show higher transparency than other currently available epoxy resist films making them highly suited for thick resist applications. The initial results show excellent uniformity, resolution and side wall profiles.

Keywords

electronics packaging; micromechanical devices; resists; sheet materials; thick film devices; MEMS manufacturing; MEMS packaging; SUEX thick epoxy resist sheet; antimony-free thick dry film epoxy sheet; next generation multipurpose MEMS material; substrate surface; Conducting materials; Conductivity; Micromechanical devices; Nanowires; Packaging; Piezoresistance; Piezoresistive devices; Resists; Silicon; Tensile stress;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on

Conference_Location

Wanchai, Hong Kong

ISSN

1084-6999

Print_ISBN

978-1-4244-5761-8

Electronic_ISBN

1084-6999

Type

conf

DOI

10.1109/MEMSYS.2010.5442479

Filename

5442479