Title :
Thick epoxy resist sheets for MEMS manufactuing and packaging
Author :
Johnson, Don ; Voigt, Anja ; Ahrens, Gisela ; Dai, Wen
Author_Institution :
DJ DevCorp, Wayland, MA, USA
Abstract :
We describe a new line of SUEX thick epoxy resist sheets which are pre-cut to substrate dimensions and can be made to thicknesses of 100¿m to more than 1mm. The sheets need only to be laminated to a substrate surface and are ready to use in minutes. We will describe the preliminary results of our developmental antimony-free thick dry film epoxy sheets (TDFS) for consideration as a next generation multi-purpose MEMS material. SUEX sheets show higher transparency than other currently available epoxy resist films making them highly suited for thick resist applications. The initial results show excellent uniformity, resolution and side wall profiles.
Keywords :
electronics packaging; micromechanical devices; resists; sheet materials; thick film devices; MEMS manufacturing; MEMS packaging; SUEX thick epoxy resist sheet; antimony-free thick dry film epoxy sheet; next generation multipurpose MEMS material; substrate surface; Conducting materials; Conductivity; Micromechanical devices; Nanowires; Packaging; Piezoresistance; Piezoresistive devices; Resists; Silicon; Tensile stress;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
Conference_Location :
Wanchai, Hong Kong
Print_ISBN :
978-1-4244-5761-8
Electronic_ISBN :
1084-6999
DOI :
10.1109/MEMSYS.2010.5442479
