DocumentCode :
2011740
Title :
Quantitative analysis of biodegradable polymers (PLLA & PCL) thermal bonding
Author :
Boutry, C.M. ; Kiran, R. ; Umbrecht, F. ; Hierold, C.
Author_Institution :
Swiss Fed. Inst. of Technol. Zurich, Zurich, Switzerland
fYear :
2010
fDate :
24-28 Jan. 2010
Firstpage :
404
Lastpage :
407
Abstract :
A quantitative analysis of the bond strength and microstructure integrity achieved when bonding the biodegradable polymers poly(L-lactide) (PLLA) and poly(e-caprolactone) (PCL) is realized using the response surface methodology (RSM). For the present packaging application the bonding parameters (temperature, pressure, duration) are adapted to optimize the bond strength; The estimated values for bond strength and channel integrity that are predicted by the surface plots are 2.32±0.26 MPa and 33.7±12.9% for PLLA, and 0.81±0.11 MPa and 50.9±5.7% for PCL. These values are in good agreement with the experimentally determined bond strength of 2.00±1.10 MPa (PLLA) & 0.67±0.22 MPa (PCL) and deformation of 31.4±7.0% (PLLA) & 52.9±4.1% (PCL). Microchannels with aspect ratio of 1:12.5 are also fabricated.
Keywords :
biodegradable materials; bonds (chemical); crystal microstructure; polymers; biodegradable polymers; bond strength; packaging application; response surface methodology; structure integrity; thermal bonding; Biodegradable materials; Bonding processes; Microchannel; Microstructure; Packaging; Polymer films; Response surface methodology; Surface fitting; Temperature; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
Conference_Location :
Wanchai, Hong Kong
ISSN :
1084-6999
Print_ISBN :
978-1-4244-5761-8
Electronic_ISBN :
1084-6999
Type :
conf
DOI :
10.1109/MEMSYS.2010.5442481
Filename :
5442481
Link To Document :
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