Title :
Two-stage interleaving network analysis to design area- and energy-efficient 3GPP-compliant receiver architectures
Author_Institution :
STMicroelectronics - Adv. Syst. Technol., Geneva, Switzerland
Abstract :
Interleaving is a key component of many digital communication systems where the encoded data is reshuffled prior to transmission to protect against burst errors. Coupled with multiplexing schemes such multi-stage subsystems achieve the necessary quality and flexibility to support a variety of different services. In 3GPP, a 2-stage multiplexing channel interleaver network is adopted. Its state-of-the-art implementation is both memory- and control-intensive, since the deinterleaving is done explicitly implying dedicated storage and processing units at each stage. In this paper, we show that the C-fold decimation property which characterizes typical block interleavers is preserved in 2-stage interleaving networks. Thus, the underlying architecture not only results in significant memory size and access rate reductions but also greatly simplifies control processing. A decline in memory size of up to 31% and in access energy of up to 54% has been observed for STMicroelectronics´ 0.13 μm CMOS technology for various 3GPP capability classes.
Keywords :
3G mobile communication; CMOS integrated circuits; cellular radio; channel coding; digital radio; interleaved codes; multiplexing; radio receivers; 0.13 micron; 2-stage multiplexing channel interleaver; 3GPP capability classes; 3GPP-compliant receiver; C-fold decimation property; STMicroelectronics CMOS technology; area-efficient receiver architectures; burst errors; digital communication systems; energy-efficient receiver architectures; memory size; multi-stage subsystems; two-stage interleaving network analysis; Chemical technology; Couplings; Digital communication; Energy efficiency; Forward error correction; Interleaved codes; Process control; Protection; Routing; Size control;
Conference_Titel :
Signal Processing Systems, 2004. SIPS 2004. IEEE Workshop on
Print_ISBN :
0-7803-8504-7
DOI :
10.1109/SIPS.2004.1363026