DocumentCode :
2011786
Title :
HPC application in 3D parameter extraction and hard IP migration for DSM IC design
Author :
Zhuang, Wenjun ; Foo, Han Yang ; Shi, Qian
Author_Institution :
Inst. of High Performance Comput., Singapore
Volume :
2
fYear :
2000
fDate :
14-17 May 2000
Firstpage :
1150
Abstract :
Entering the era of deep sub-micron, Singapore has put a lot of effort into the development of design and manufacturing capability in the microelectronics industry. The Institute of High Performance Computing has invested in manpower, high-performance computing hardware, and state-of-the-art EDA CAD tools to assist and support local microelectronics industry in applications such as 3D parameter extraction and hard IP migration.
Keywords :
circuit CAD; integrated circuit design; logic CAD; parallel processing; 3D parameter extraction; DSM IC design; EDA CAD tools; Singapore; deep sub-micron; hard IP migration; high-performance computing; microelectronics industry;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
High Performance Computing in the Asia-Pacific Region, 2000. Proceedings. The Fourth International Conference/Exhibition on
Conference_Location :
Beijing, China
Print_ISBN :
0-7695-0589-2
Type :
conf
DOI :
10.1109/HPC.2000.843616
Filename :
843616
Link To Document :
بازگشت