DocumentCode
2011797
Title
PDMS bonding to organically-modified solid surface using photocatalyst for fabricating low-cost plastic microchip
Author
Hwang, Kyu-Youn ; Kim, Joon-Ho ; Suh, Kahp-Yang ; Ko, Jong-Soo ; Huh, Nam
Author_Institution
Bio&Health Lab., Samsung Electron., Co., South Korea
fYear
2010
fDate
24-28 Jan. 2010
Firstpage
396
Lastpage
399
Abstract
A novel PDMS bonding technique using photocatalyst has been developed to fabricate polymer-based DNA sample preparation microchip for molecular diagnostics. To bond PDMS substrate onto organosilane-modified pillar arrays, organosilane layer on top plane of micropillars was selectively removed through photocatalytic oxidation using TiO2 and UV irradiation. The proposed method exposed underlying SiO2 surface without deteriorating the organic film on lateral surface of the micropillars which is used for bacterial adhesion, and then resulting SiO2 layer was bonded to PDMS. The low-cost plastic DNA sample preparation chip has been successfully fabricated and it demonstrated similar performance to Glass/Si chip in terms of bacterial cell capture efficiency and PCR compatibility.
Keywords
bioMEMS; catalysis; oxidation; photochemistry; silicon compounds; titanium compounds; ultraviolet radiation effects; PDMS bonding; PDMS substrate; SiO2; TiO2; UV irradiation; bacterial adhesion; low-cost plastic DNA chip; low-cost plastic microchip fabrication; micropillars; organic film; organically-modified solid surface; organosilane layer; organosilane-modified pillar arrays; photocatalyst; photocatalytic oxidation; Adhesives; Bonding; DNA; Glass; Microorganisms; Oxidation; Plastics; Polymers; Solids; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
Conference_Location
Wanchai, Hong Kong
ISSN
1084-6999
Print_ISBN
978-1-4244-5761-8
Electronic_ISBN
1084-6999
Type
conf
DOI
10.1109/MEMSYS.2010.5442483
Filename
5442483
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