• DocumentCode
    2011797
  • Title

    PDMS bonding to organically-modified solid surface using photocatalyst for fabricating low-cost plastic microchip

  • Author

    Hwang, Kyu-Youn ; Kim, Joon-Ho ; Suh, Kahp-Yang ; Ko, Jong-Soo ; Huh, Nam

  • Author_Institution
    Bio&Health Lab., Samsung Electron., Co., South Korea
  • fYear
    2010
  • fDate
    24-28 Jan. 2010
  • Firstpage
    396
  • Lastpage
    399
  • Abstract
    A novel PDMS bonding technique using photocatalyst has been developed to fabricate polymer-based DNA sample preparation microchip for molecular diagnostics. To bond PDMS substrate onto organosilane-modified pillar arrays, organosilane layer on top plane of micropillars was selectively removed through photocatalytic oxidation using TiO2 and UV irradiation. The proposed method exposed underlying SiO2 surface without deteriorating the organic film on lateral surface of the micropillars which is used for bacterial adhesion, and then resulting SiO2 layer was bonded to PDMS. The low-cost plastic DNA sample preparation chip has been successfully fabricated and it demonstrated similar performance to Glass/Si chip in terms of bacterial cell capture efficiency and PCR compatibility.
  • Keywords
    bioMEMS; catalysis; oxidation; photochemistry; silicon compounds; titanium compounds; ultraviolet radiation effects; PDMS bonding; PDMS substrate; SiO2; TiO2; UV irradiation; bacterial adhesion; low-cost plastic DNA chip; low-cost plastic microchip fabrication; micropillars; organic film; organically-modified solid surface; organosilane layer; organosilane-modified pillar arrays; photocatalyst; photocatalytic oxidation; Adhesives; Bonding; DNA; Glass; Microorganisms; Oxidation; Plastics; Polymers; Solids; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
  • Conference_Location
    Wanchai, Hong Kong
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-5761-8
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2010.5442483
  • Filename
    5442483