DocumentCode
2011832
Title
A fast three-dimensional image reconstruction method for ERT
Author
Fan, Wenru ; Wang, Huaxiang
Author_Institution
Sch. of Electr. Eng. & Autom., Tianjin Univ., Tianjin
fYear
2009
fDate
11-12 May 2009
Firstpage
32
Lastpage
36
Abstract
Electrical resistance tomography (ERT) aims to estimate the electrical properties at the interior of an object from current-voltage measurements on its boundary. Although two-dimensional model is commonly used in most research, it cannot satisfy practical needs. In this paper, three different electrode structures in three-dimension (3D) were proposed and compared. An advanced version of the conjugate gradient (CG) method, i.e. the Schur CG method, is used to solve the inverse problem for 3D ERT. The solution space is divided into two subspaces. The main part of the solution lies in the coarse subspace, which can be calculated directly and its corresponding correction term with a small norm can be solved in the Schur complement subspace. In order to improve the disadvantage of ill-posed for EIT problem, we also investigate three different multilayer electrode structures for 3D models. Experimental results obtained by the Schur CG algorithm are also presented, indicating that the Schur CG algorithm can improve the quality of reconstructed image and real time performance.
Keywords
conjugate gradient methods; electric reactance measurement; electrodes; image reconstruction; tomography; ERT; Schur CG method; conjugate gradient method; current-voltage measurement; electrical resistance tomography; electrode structure; fast 3D image reconstruction; image quality; Character generation; Current measurement; Electric resistance; Electric variables measurement; Electrical resistance measurement; Electrodes; Image reconstruction; Inverse problems; Nonhomogeneous media; Tomography; Electrical impedance tomography (ERT); Schur conjugate gradient method; conjugate gradient method; image reconstruction;
fLanguage
English
Publisher
ieee
Conference_Titel
Imaging Systems and Techniques, 2009. IST '09. IEEE International Workshop on
Conference_Location
Shenzhen
Print_ISBN
978-1-4244-3482-4
Electronic_ISBN
978-1-4244-3483-1
Type
conf
DOI
10.1109/IST.2009.5071597
Filename
5071597
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