Micromachined capacitors based on automated multilayer electroplating

Author

Galle, Preston ; Kim, Seong-Hyok ; Shah, Urvi ; Allen, Mark G.

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2010

fDate

24-28 Jan. 2010

Firstpage

332

Lastpage

335

Abstract

A new type of capacitor, based on a high-aspect-ratio 3-dimensional micromachining process, is presented. Submicron layers of alternating metals are deposited by an automated robotic electroplating system. Selective etching of one of the two metals leaves a highly laminated structure with large surface area. To demonstrate the increased surface area, this structure is used as one electrode of a capacitor. A dielectric layer is added by atomic layer deposition (ALD) of alumina. A liquid electrolyte is added and vacuum-infiltrated to form the second electrode. 1.5 nF/mm² capacitance density is produced with a 10-layer structure.

Keywords

aluminium; atomic layer deposition; capacitors; electroplating; etching; micromachining; robots; 3-dimensional micromachining process; alternating metals; alumina; atomic layer deposition; automated multilayer electroplating; automated robotic electroplating system; dielectric layer; liquid electrolyte; micromachined capacitor; selective etching; vacuum-infiltration; Capacitors; Electrodes; Energy management; Etching; Fabrication; Lithography; Magnetic multilayers; Micromachining; Nonhomogeneous media; Parasitic capacitance;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on

Conference_Location

Wanchai, Hong Kong

ISSN

1084-6999

Print_ISBN

978-1-4244-5761-8

Electronic_ISBN

1084-6999

Type

conf

DOI

10.1109/MEMSYS.2010.5442499

Filename

5442499