DocumentCode :
2012313
Title :
MC-CDMA/VSF for the downlink physical layer in next generation wireless local area networks
Author :
Díaz De León, Carlos Adrián Gutiérrez ; García, Jaime Sánchez ; Bean, Margarita Cabrera ; De León, Luis Alberto Gutiérrez Díaz
Author_Institution :
Dept. of Electron. & Telecommun., CICESE Res. Center, Ensenada, Mexico
fYear :
2004
fDate :
13-15 Oct. 2004
Firstpage :
221
Lastpage :
226
Abstract :
In this paper, a new physical layer for the downlink in future generation wireless local area networks (WLANs), operating in the ISM band, and based on multi-carrier CDMA (MC-CDMA) is proposed. Taking advantage of the CDMA properties, this physical layer aims to provide service simultaneously to several users with different data rate needs. Orthogonal variable spreading factor (OVSF) codes are employed in order to support the simultaneous coexistence of different data rate users. In addition, the bit error rate (BER) performance of the system is analyzed for different combination techniques when single-user detection is employed in a frequency selective slow fading Rician channel. According to the results presented in this paper, this proposal is a promising option for WLANs.
Keywords :
OFDM modulation; Rician channels; channel coding; code division multiple access; equalisers; error statistics; variable length codes; wireless LAN; BER; ISM band; MC-CDMA; MC-CDMA/VSF; OVSF codes; WLAN downlink physical layer; channel coding; combination techniques; combined OFDM-CDMA; frequency domain equalization; frequency selective slow fading Rician channel; interleaving; multicarrier CDMA; multiuser data rate requirements; orthogonal variable spreading factor codes; single-user detection; wireless local area networks; Bit error rate; Downlink; Fading; Frequency; Multiaccess communication; Multicarrier code division multiple access; Next generation networking; Performance analysis; Physical layer; Wireless LAN;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Signal Processing Systems, 2004. SIPS 2004. IEEE Workshop on
Print_ISBN :
0-7803-8504-7
Type :
conf
DOI :
10.1109/SIPS.2004.1363053
Filename :
1363053
Link To Document :
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