DocumentCode
2012323
Title
Development of Nanostructures in Thermoelectric Pb-Te-Sb Alloys
Author
Ikeda, T. ; Ravi, V. ; Collins, L.A. ; Haile, S.M. ; Snyder, G.J.
Author_Institution
California Inst. of Technol., Pasadena, CA
fYear
2006
fDate
6-10 Aug. 2006
Firstpage
172
Lastpage
175
Abstract
In analogy to recent demonstrations of enhanced thermoelectric properties in superlattice materials, composite structures with nanoscale features promise dramatic improvements in the figure of merit of thermoelectric materials. Fabrication of nanostructured thermoelectric materials via bulk synthesis is an attractive route for commercial applications. Nanometer scale lamellae of PbTe and Sb2 Te3 form when quenched eutectic PbTe-Sb2Te 3 melt is subsequently annealed. The lamellar spacing depends on the temperature and time of the anneal. The mechanism for the development of the nanostructures can be characterized by examining the fraction of material transformed as a function of anneal time. Preliminary analysis of the shape factor exponent reveals that the evolution of the nanostructured lamellae is likened to the thickening of very large plates. The coarsening of the lamellar spacing is also examined as a function of time
Keywords
annealing; antimony compounds; lead compounds; nanocomposites; semiconductor materials; thermoelectricity; PbTe-Sb2Te3; annealing time; bulk synthesis; coarsening; composite structures; figure of merit; lamellar spacing; nanometer scale lamellae; nanostructured thermoelectric material; quenched eutectic melt; shape factor exponent; superlattice materials; thermoelectric alloys; Annealing; Composite materials; Fabrication; Nanostructured materials; Nanostructures; Shape; Superlattices; Tellurium; Temperature dependence; Thermoelectricity; Coarsening; Fraction transformed; Lamellar spacing; Thermoelectric;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 2006. ICT '06. 25th International Conference on
Conference_Location
Vienna
ISSN
1094-2734
Print_ISBN
1-4244-0811-3
Electronic_ISBN
1094-2734
Type
conf
DOI
10.1109/ICT.2006.331326
Filename
4133264
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