DocumentCode :
2012323
Title :
Development of Nanostructures in Thermoelectric Pb-Te-Sb Alloys
Author :
Ikeda, T. ; Ravi, V. ; Collins, L.A. ; Haile, S.M. ; Snyder, G.J.
Author_Institution :
California Inst. of Technol., Pasadena, CA
fYear :
2006
fDate :
6-10 Aug. 2006
Firstpage :
172
Lastpage :
175
Abstract :
In analogy to recent demonstrations of enhanced thermoelectric properties in superlattice materials, composite structures with nanoscale features promise dramatic improvements in the figure of merit of thermoelectric materials. Fabrication of nanostructured thermoelectric materials via bulk synthesis is an attractive route for commercial applications. Nanometer scale lamellae of PbTe and Sb2 Te3 form when quenched eutectic PbTe-Sb2Te 3 melt is subsequently annealed. The lamellar spacing depends on the temperature and time of the anneal. The mechanism for the development of the nanostructures can be characterized by examining the fraction of material transformed as a function of anneal time. Preliminary analysis of the shape factor exponent reveals that the evolution of the nanostructured lamellae is likened to the thickening of very large plates. The coarsening of the lamellar spacing is also examined as a function of time
Keywords :
annealing; antimony compounds; lead compounds; nanocomposites; semiconductor materials; thermoelectricity; PbTe-Sb2Te3; annealing time; bulk synthesis; coarsening; composite structures; figure of merit; lamellar spacing; nanometer scale lamellae; nanostructured thermoelectric material; quenched eutectic melt; shape factor exponent; superlattice materials; thermoelectric alloys; Annealing; Composite materials; Fabrication; Nanostructured materials; Nanostructures; Shape; Superlattices; Tellurium; Temperature dependence; Thermoelectricity; Coarsening; Fraction transformed; Lamellar spacing; Thermoelectric;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermoelectrics, 2006. ICT '06. 25th International Conference on
Conference_Location :
Vienna
ISSN :
1094-2734
Print_ISBN :
1-4244-0811-3
Electronic_ISBN :
1094-2734
Type :
conf
DOI :
10.1109/ICT.2006.331326
Filename :
4133264
Link To Document :
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