Title :
Three-DOF CMOS-MEMS probes with embedded piezoresistive sensors
Author :
Liu, J. ; Draghi, L. ; Bain, J.A. ; Schlesinger, T.E. ; Fedder, G.K.
Author_Institution :
Carnegie Mellon Univ., Pittsburgh, PA, USA
Abstract :
We report on a new 3-DOF CMOS-MEMS electrothermal probe, featuring embedded piezoresistive sensors. These probes have the potential to be used independently for general 3-DOF nanoscale manipulation/manufacturing/scanning without external actuation and sensing. In this probe design, 3-DOF piezoresistive sensors are used to track probe actuation and applied force in all three directions, and thermal management such as dummy heater beams and metal-slotted thermal isolation structures are used to improve drive sensitivity.
Keywords :
CMOS integrated circuits; micromechanical devices; piezoresistive devices; probes; sensors; 3-DOF CMOS MEMS electrothermal probe; 3-DOF piezoresistive sensors; complementary metal-oxide-semiconductor; dummy heater beams; embedded piezoresistive sensors; metal-slotted thermal isolation structures; microelectromechanical system; probe actuation; thermal management; Actuators; Atomic force microscopy; Capacitive sensors; Electrothermal effects; Force sensors; Grippers; Piezoresistance; Probes; Thermal force; Thermal management;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
Conference_Location :
Wanchai, Hong Kong
Print_ISBN :
978-1-4244-5761-8
Electronic_ISBN :
1084-6999
DOI :
10.1109/MEMSYS.2010.5442511
