DocumentCode :
2012395
Title :
High Capacity Thermoelectric Temperature Control Systems
Author :
Bell, L.E. ; Crane, D.T.
Author_Institution :
BSST LLC, Irwindale, CA
fYear :
2006
fDate :
6-10 Aug. 2006
Firstpage :
193
Lastpage :
197
Abstract :
Recent advances in TE technology enable a new class of solid state cooling, heating, and temperature control systems. The new designs utilize advanced thermodynamic cycles [Bell, LE, 2002] to improve the Coefficient of Performance (COP) by about a factor of two, so that performance levels are comparable to those of two phase compressor based systems in certain important applications. Further improvement has resulted from optimized designs that employ TE components with increased power density [Diller, RW, et. al., 2002] and reduced temperature differentials at the TE/electrode interfaces in the heat transfer path. Together, these improvements enable new system configurations that in important applications are performance competitive with two phase systems for heating and cooling capacities of up to 3,500 watts. By utilizing high power design concepts and system level design optimization [Bell, LE, 2004], TE material costs per watt of thermal power output is reduced by about a factor of four. A system design is presented that is suitable for output thermal power ranging from 50 to 5,000 watts in either heating or cooling modes. The present design is compared with a similar design using conventional TE modules in terms of size, weight, efficiency, and power density. Experimental results are presented that demonstrate good correlation between measured values and the predicted COP performance enhancements and TE material usage reductions
Keywords :
cooling; heating; temperature control; thermoelectric devices; thermoelectric power; 50 to 5000 W; TE component power density; TE technology; TE-electrode interface temperature differentials; advanced thermodynamic cycles; heat transfer path; high power design concepts; output thermal power; performance coefficient; solid state cooling; solid state heating; system configurations; system level design optimization; thermoelectric temperature control systems; Cooling; Design optimization; Electrodes; Heat transfer; Heating; Solid state circuits; Tellurium; Temperature control; Thermodynamics; Thermoelectricity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermoelectrics, 2006. ICT '06. 25th International Conference on
Conference_Location :
Vienna
ISSN :
1094-2734
Print_ISBN :
1-4244-0811-3
Electronic_ISBN :
1094-2734
Type :
conf
DOI :
10.1109/ICT.2006.331331
Filename :
4133269
Link To Document :
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