• DocumentCode
    2012418
  • Title

    Fabrication of carbon nanomechanical resonators with embedded single walled carbon nanotube stiffening layers

  • Author

    Lee, Seung Hoon ; Min, Bumki ; Park, Se Il ; Lee, Kwang-Cheol ; Lee, Seung S.

  • Author_Institution
    Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
  • fYear
    2010
  • fDate
    24-28 Jan. 2010
  • Firstpage
    268
  • Lastpage
    271
  • Abstract
    This study presents a new fabrication method for high frequency nanomechanical resonators by utilizing carbon layers with embedded single walled carbon-nanotube layers. The carbon layers, fabricated by pyrolysis of photo- or electron beam resists, showed low-density and moderate Young´s modulus which is suitable to sensitive nanodevices. The carbon-nanotube layers underneath carbon layers enhanced conductivity and Young´s modulus while maintaining low-density of carbon nanoresonators. These two layers are fashioned into doubly clamped nanomechanical beams by electron beam lithography and carbon dry etching processes. Dynamic behaviors such as resonant frequency and Q-factor are investigated using magnetomotive detection method.
  • Keywords
    Q-factor; Young´s modulus; carbon nanotubes; electron beam lithography; etching; nanoelectromechanical devices; nanofabrication; nanolithography; photoresists; pyrolysis; resonators; C; Q-factor; Young modulus; carbon dry etching process; carbon nanomechanical resonator fabrication; doubly clamped nanomechanical beam; electron beam lithography; electron beam resists; embedded single walled carbon nanotube stiffening layer; high frequency nanomechanical resonator; magnetomotive detection method; photoresists; pyrolysis; resonant frequency; Carbon nanotubes; Conductivity; Dry etching; Electron beams; Fabrication; Lithography; Magnetic resonance; Q factor; Resists; Resonant frequency;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
  • Conference_Location
    Wanchai, Hong Kong
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-5761-8
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2010.5442515
  • Filename
    5442515