DocumentCode :
2012475
Title :
Transient Behavior Study of Thermoelectric Generators through an Electro-thermal Model Using SPICE
Author :
Chen, M. ; Rosendahl, L.A. ; Bach, I. ; Condra, T. ; Pedersen, J.K.
Author_Institution :
Inst. of Energy Technol., Aalborg Univ.
fYear :
2006
fDate :
6-10 Aug. 2006
Firstpage :
214
Lastpage :
219
Abstract :
A thermoelectric generator (TEG) usually works in dynamic operating conditions due to the time change, in real applications, of the electric load and hot or cold temperatures. Thus understanding transient thermal and electrical behavior of the device, besides the steady-state behavior, is important in order to investigate the global device performance. The major objective of this work is to describe the transient behavior of TEG operating in high temperature environments through a SPICE model based on an electrothermal analogy. The SPICE model presented is derived from a one dimensional (1-D) heat transfer differential equation. An important feature of the model is its ability to calculate the temperature profile taking the real temperature dependence of the materials properties into account. This feature is essential in simulating TEG exposed to a large temperature difference. In combination with considering the finite heat transfer rate at the interface between TEG and thermal ambient, the model is able to reflect the thermo-electric coupled multi-field system effect of TEG. A test rig is developed for verifying the proposed model. Commercially available TEG is tested with respect to stabilizing time under sharply changed electric load. The preliminary results of experiments and modeling are analyzed. It is expected that the model presented can assist, not only in the optimal design of TEG itself, but also in the evaluation of the whole energy system
Keywords :
SPICE; heat transfer; thermoelectric conversion; 1D heat transfer differential equation; SPICE model; TEG dynamic operating conditions; TEG optimal design; TEG simulation; TEG-thermal ambient interface; electric load; electrothermal model; energy system evaluation; finite heat transfer rate; global device performance; high temperature TEG operation; temperature profile calculation; thermoelectric coupled multi-field system effect; thermoelectric generator; transient TEG electrical behavior; transient TEG thermal behavior; Circuit simulation; Heat transfer; Material properties; Power generation; SPICE; Steady-state; Temperature dependence; Temperature distribution; Thermoelectric devices; Thermoelectricity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermoelectrics, 2006. ICT '06. 25th International Conference on
Conference_Location :
Vienna
ISSN :
1094-2734
Print_ISBN :
1-4244-0811-3
Electronic_ISBN :
1094-2734
Type :
conf
DOI :
10.1109/ICT.2006.331335
Filename :
4133273
Link To Document :
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