• DocumentCode
    2012553
  • Title

    AFM characterization of adhesion force in micro-relays

  • Author

    Lee, Donovan ; Pott, Vincent ; Kam, Hei ; Nathanael, Rhesa ; Liu, Tsu-Jae King

  • Author_Institution
    Univ. of California, Berkeley, CA, USA
  • fYear
    2010
  • fDate
    24-28 Jan. 2010
  • Firstpage
    232
  • Lastpage
    235
  • Abstract
    Characterization of adhesion force using atomic force microscopy is adapted for micro-relay applications. Measurements indicate that micro-relays with W contacting electrodes have low adhesion force (<16.5 nN/¿m2). Adhesion force, as expected, scales with contact force and contact area. TiO2 coating to improve relay reliability comes at a trade-off in surface adhesion force, which will ultimately limit energy efficiency.
  • Keywords
    adhesion; atomic force microscopy; microrelays; AFM characterization; TiO2; atomic force microscopy; coating; contact force; contacting electrodes; energy efficiency; microrelays; surface adhesion force; Adhesives; Atomic force microscopy; Coatings; Contacts; Digital relays; Electrodes; Force measurement; Microrelays; Surface resistance; Surface treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
  • Conference_Location
    Wanchai, Hong Kong
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-5761-8
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2010.5442522
  • Filename
    5442522
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2012553