DocumentCode :
2012553
Title :
AFM characterization of adhesion force in micro-relays
Author :
Lee, Donovan ; Pott, Vincent ; Kam, Hei ; Nathanael, Rhesa ; Liu, Tsu-Jae King
Author_Institution :
Univ. of California, Berkeley, CA, USA
fYear :
2010
fDate :
24-28 Jan. 2010
Firstpage :
232
Lastpage :
235
Abstract :
Characterization of adhesion force using atomic force microscopy is adapted for micro-relay applications. Measurements indicate that micro-relays with W contacting electrodes have low adhesion force (<16.5 nN/¿m2). Adhesion force, as expected, scales with contact force and contact area. TiO2 coating to improve relay reliability comes at a trade-off in surface adhesion force, which will ultimately limit energy efficiency.
Keywords :
adhesion; atomic force microscopy; microrelays; AFM characterization; TiO2; atomic force microscopy; coating; contact force; contacting electrodes; energy efficiency; microrelays; surface adhesion force; Adhesives; Atomic force microscopy; Coatings; Contacts; Digital relays; Electrodes; Force measurement; Microrelays; Surface resistance; Surface treatment;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
Conference_Location :
Wanchai, Hong Kong
ISSN :
1084-6999
Print_ISBN :
978-1-4244-5761-8
Electronic_ISBN :
1084-6999
Type :
conf
DOI :
10.1109/MEMSYS.2010.5442522
Filename :
5442522
Link To Document :
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