• DocumentCode
    2012690
  • Title

    Cooling Enhancement Using Inhomogeneous Thermoelectric Materials

  • Author

    Bian, Zhixi ; Shakouri, Ali

  • Author_Institution
    Baskin Sch. of Eng., California Univ., Santa Cruz, CA
  • fYear
    2006
  • fDate
    6-10 Aug. 2006
  • Firstpage
    264
  • Lastpage
    267
  • Abstract
    The maximum cooling temperature of a thermoelectric refrigerator made of uniform bulk material is limited by its dimensionless figure-of-merit ZT. Cascaded stages are typically needed in order to obtain a higher cooling temperature. Multiple stage configurations have disadvantages of device complexity, and reduced efficiency due to the non-ideal heat spreading between different stages. In this paper, we prove that the maximum cooling temperature can be increased by using a single stage made of inhomogeneous material. This optimization is different from conventional graded materials where there is a large temperature gradient and local material properties are optimized in order to achieve the highest ZT at the local temperature under operation. The new optimization is attributed to the redistribution of the Joule heating and Peltier cooling profiles along the current and heat flow directions. The cooling efficiency can also be increased by a moderate amount. Numerical simulations are used to optimize the doping profile for a thermoelectric cooler based on single crystal silicon
  • Keywords
    Peltier effect; cooling; doping profiles; electrical conductivity; electrical resistivity; refrigeration; thermal conductivity; thermal management (packaging); Joule heating profile; Peltier cooling profile; Si; cooling enhancement; current flow direction; device complexity; figure of merit; heat flow direction; inhomogeneous thermoelectric materials; maximum cooling temperature; nonideal heat spreading; reduced cooling efficiency; single crystal silicon; single stage cooling; thermoelectric cooler doping profile; thermoelectric refrigerator; Composite materials; Conducting materials; Cooling; Crystalline materials; Refrigeration; Resistance heating; Silicon; Temperature; Thermal conductivity; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2006. ICT '06. 25th International Conference on
  • Conference_Location
    Vienna
  • ISSN
    1094-2734
  • Print_ISBN
    1-4244-0811-3
  • Electronic_ISBN
    1094-2734
  • Type

    conf

  • DOI
    10.1109/ICT.2006.331365
  • Filename
    4133284