• DocumentCode
    2012753
  • Title

    FDTD modeling of a SIW based sensor for THz diagnostics

  • Author

    Bozza, Giovanni ; Caviglia, Daniele D. ; Pastorino, Matteo

  • Author_Institution
    Dept. of Biophys. & Electron. Eng., Univ. of Genoa, Genoa
  • fYear
    2009
  • fDate
    11-12 May 2009
  • Firstpage
    258
  • Lastpage
    262
  • Abstract
    In this contribution finite-difference time-domain (FDTD) modeling and simulations of sensors for Terahertz (THz) diagnostics are described. substrate integrated waveguide (SIW) structures are addressed and their potential use as sensors is evaluated in some configurations of interest. In particular, the considered THz sensor is obtained by means of an open SIW waveguide which transmits and receives the electromagnetic waves used for the inspection of the target under test. Substrate integrated waveguides allow THz waves propagation by using quite standard Printed Circuit Board (PCB) technology and so they may be good candidates for obtaining guiding structures in the THz band with moderate costs and the possibility of integration with other devices. The adopted FDTD simulator is able to take into account of both the propagation inside the SIW and the interactions of THz waves with dielectric structures.
  • Keywords
    electromagnetic wave transmission; finite difference time-domain analysis; printed circuits; substrate integrated waveguides; terahertz wave detectors; FDTD simulator model; SIW based sensor diagnostics; SIW dielectric structure; electromagnetic wave transmission; standard printed circuit board technology; substrate integrated waveguide; terahertz wave band sensor; Circuit testing; Electromagnetic propagation; Electromagnetic scattering; Electromagnetic waveguides; Finite difference methods; Inspection; Printed circuits; Sensor phenomena and characterization; Time domain analysis; Waveguide components;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Imaging Systems and Techniques, 2009. IST '09. IEEE International Workshop on
  • Conference_Location
    Shenzhen
  • Print_ISBN
    978-1-4244-3482-4
  • Electronic_ISBN
    978-1-4244-3483-1
  • Type

    conf

  • DOI
    10.1109/IST.2009.5071645
  • Filename
    5071645