Title :
Packaging Of Split-contact Semiconductor Optical Amplifiers
Author :
Urban, M. ; Sargent, R. ; Boudreau, Richard ; Rideout, W. ; Schlafer, J.
Author_Institution :
GTELaboratories Incorporated
Keywords :
Fixtures; Integrated circuit packaging; Integrated circuit yield; Microstrip; Optical devices; Optical fiber devices; Optical fiber testing; Photonic integrated circuits; Semiconductor device packaging; Semiconductor optical amplifiers;
Conference_Titel :
LEOS '92, Conference Proceedings. IEEE Lasers and Electro-Optics Society, 1992 Annual Meeting
Print_ISBN :
0-7803-0526-4
DOI :
10.1109/LEOS.1992.693938
