Title :
Application of electrical resistance tomography for slug flow measurement in gas/liquid flow of horizontal pipe
Author :
Xu, Yanbin ; Wang, Huaxiang ; Cui, Ziqiang ; Dong, Feng
Author_Institution :
Sch. of Electr. Eng. & Autom., Tianjin Univ., Tianjin
Abstract :
It is important to study the slug flow in a gas/liquid flow to achieve an in-depth understanding of the mixture flow and optimization of industrial processes. This paper presents a study of the slug flow measurement in gas/liquid flow of horizontal pipe. The application of ERT for slug flow measurement is demonstrated and described, including the visualization of slug size and shape. A novel method to obtain the liquid slug velocity is put forward. Independent component analysis (ICA) method has been applied to extract the liquid slug information. A good agreement between the independent component with the maximal kurtosis and liquid slug fluctuation of slug flow is observed. Through correlating independent component with the maximal kurtosis from upstream and downstream planes, the mean velocity and the length of liquid slug have been obtained. The comparison between the mean velocity from the ERT system and CCD camera is presented. The experimental results show the method is reasonable for the slug flow measurement in horizontal pipe.
Keywords :
electric impedance imaging; flow visualisation; multiphase flow; pipe flow; tomography; downstream plane; electrical resistance tomography; gas-liquid flow; horizontal pipe; independent component analysis; liquid slug fluctuation; liquid slug velocity; maximal kurtosis; slug flow measurement; upstream plane; Electric resistance; Electric variables measurement; Electrical resistance measurement; Fluid flow; Fluid flow measurement; Gas industry; Independent component analysis; Shape measurement; Size measurement; Tomography; Electrical resistance tomography; Independent component analysis; Slug flow; Slug velocity;
Conference_Titel :
Imaging Systems and Techniques, 2009. IST '09. IEEE International Workshop on
Conference_Location :
Shenzhen
Print_ISBN :
978-1-4244-3482-4
Electronic_ISBN :
978-1-4244-3483-1
DOI :
10.1109/IST.2009.5071657