Title :
Flexible Thin-film Planar Peltier Microcooler
Author :
Goncalves, L.M. ; Couto, C. ; Correia, J.H. ; Alpuim, P. ; Min, Gao ; Rowe, D.M.
Author_Institution :
Dept. of Electron., Minho Univ., Guimaraes
Abstract :
The present work reports on the fabrication and characterization of a planar Peltier microcooler on flexible substrate. The microcooler was fabricated on flexible Kaptoncopy polyimide sheet, 12 mum thick, using Bi2Te3 and Sb2Te3 thermoelectric elements, deposited by thermal co-evaporation. The cold area of the device (4 mm2) is cooled using four pairs of thermoelectric elements, connected in series with aluminium/nickel contacts. Optimization of deposition parameters allowed the fabrication of films with power factors of 4.9 times 10-3 WmiddotK -2middotm-1 and 3.3 times 10-3 WmiddotK-2middotm-1 for Bi2Te3 and Sb2Te3, respectively. These values are comparable with the best published results for the same material, under various fabrication methods (thermal co-evaporation, sputtering, MOCVD, flash-evaporation or ECD). The performance of the Peltier microcooler was analyzed by infrared image microscopy in still-air and vacuum. The temperature difference between the cold side and the hot side of the device was 4degC
Keywords :
Peltier effect; antimony alloys; bismuth alloys; cooling; electrical contacts; micromechanical devices; tellurium alloys; thermoelectric devices; thin films; vacuum deposition; 12 micron; 4 mm; Bi2Te3; Sb2Te3; aluminium contacts; antimony telluride thermoelectric element; bismuth telluride thermoelectric element; deposition parameters; device cold area; device hot side; flexible Kapton polyimide sheet; flexible substrate; flexible thin-film planar Peltier microcooler; infrared image microscopy; nickel contacts; planar Peltier microcooler characterization; planar Peltier microcooler fabrication; power factors; thermal co-evaporation deposition; Aluminum; Bismuth; Fabrication; Nickel; Polyimides; Substrates; Tellurium; Thermoelectric devices; Thermoelectricity; Transistors;
Conference_Titel :
Thermoelectrics, 2006. ICT '06. 25th International Conference on
Conference_Location :
Vienna
Print_ISBN :
1-4244-0811-3
Electronic_ISBN :
1094-2734
DOI :
10.1109/ICT.2006.331217