• DocumentCode
    2012978
  • Title

    Flexible Thin-film Planar Peltier Microcooler

  • Author

    Goncalves, L.M. ; Couto, C. ; Correia, J.H. ; Alpuim, P. ; Min, Gao ; Rowe, D.M.

  • Author_Institution
    Dept. of Electron., Minho Univ., Guimaraes
  • fYear
    2006
  • fDate
    6-10 Aug. 2006
  • Firstpage
    327
  • Lastpage
    331
  • Abstract
    The present work reports on the fabrication and characterization of a planar Peltier microcooler on flexible substrate. The microcooler was fabricated on flexible Kaptoncopy polyimide sheet, 12 mum thick, using Bi2Te3 and Sb2Te3 thermoelectric elements, deposited by thermal co-evaporation. The cold area of the device (4 mm2) is cooled using four pairs of thermoelectric elements, connected in series with aluminium/nickel contacts. Optimization of deposition parameters allowed the fabrication of films with power factors of 4.9 times 10-3 WmiddotK -2middotm-1 and 3.3 times 10-3 WmiddotK-2middotm-1 for Bi2Te3 and Sb2Te3, respectively. These values are comparable with the best published results for the same material, under various fabrication methods (thermal co-evaporation, sputtering, MOCVD, flash-evaporation or ECD). The performance of the Peltier microcooler was analyzed by infrared image microscopy in still-air and vacuum. The temperature difference between the cold side and the hot side of the device was 4degC
  • Keywords
    Peltier effect; antimony alloys; bismuth alloys; cooling; electrical contacts; micromechanical devices; tellurium alloys; thermoelectric devices; thin films; vacuum deposition; 12 micron; 4 mm; Bi2Te3; Sb2Te3; aluminium contacts; antimony telluride thermoelectric element; bismuth telluride thermoelectric element; deposition parameters; device cold area; device hot side; flexible Kapton polyimide sheet; flexible substrate; flexible thin-film planar Peltier microcooler; infrared image microscopy; nickel contacts; planar Peltier microcooler characterization; planar Peltier microcooler fabrication; power factors; thermal co-evaporation deposition; Aluminum; Bismuth; Fabrication; Nickel; Polyimides; Substrates; Tellurium; Thermoelectric devices; Thermoelectricity; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2006. ICT '06. 25th International Conference on
  • Conference_Location
    Vienna
  • ISSN
    1094-2734
  • Print_ISBN
    1-4244-0811-3
  • Electronic_ISBN
    1094-2734
  • Type

    conf

  • DOI
    10.1109/ICT.2006.331217
  • Filename
    4133298