• DocumentCode
    2013354
  • Title

    Structural Characteristics of Bi2Te3 and Sb2Te3 films on (001) GaAs Substrates grown by MOCVD

  • Author

    Kim, Jeong-Hun ; Kwon, Sung-Do ; Jeong, Dae-Yong ; Ju, Byeong-Kwon ; Yoon, Seok-Jin ; Kim, Jin-Sang

  • Author_Institution
    Thin film Mater. Res. center, Korea Inst. of Sci. & Technol., Seoul
  • fYear
    2006
  • fDate
    6-10 Aug. 2006
  • Firstpage
    411
  • Lastpage
    413
  • Abstract
    Metal organic vapour phase epitaxy has been investigated for growth of Bi2Te3 and Sb2Te3 films on (001) GaAs substrates using trimethylbismuth, triethylantimony and diisopropyltelluride as metal organic sources. High resolution TEM and X-ray diffraction patterns revealed that films had single crystalline phases with a preferential c-orientation and layered structures resulting from the van der Waals bonding nature in these materials. By optimizing growth parameters such as precursor ratio, growth temperatures, and flow rate in reactor, we could obtain Seebeck coefficient of -160muVK-1 for Bi2Te3 and +110muVK-1 for Sb2Te3 films, respectively. The high Seebeck coefficient and atomistically smooth surface morphologies of these materials are promising for the fabrication of a few nm thick periodic Bi2Te3/Sb 2Te3super lattice structures for thin film thermoelectric device applications
  • Keywords
    MOCVD; Seebeck effect; X-ray diffraction; crystal orientation; semiconductor thin films; surface morphology; transmission electron microscopy; van der Waals forces; Bi2Te3; GaAs; GaAs substrate; MOCVD; Sb2Te3; Seebeck coefficient; TEM analysis; X-ray diffraction; crystal orientation; diisopropyltelluride precursor; layered structure; metal organic vapour phase epitaxy; surface morphologies; triethylantimony precursor; trimethylbismuth precursor; van der Waals bonding; Bismuth; Bonding; Crystalline materials; Crystallization; Epitaxial growth; Gallium arsenide; MOCVD; Substrates; Tellurium; X-ray diffraction;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2006. ICT '06. 25th International Conference on
  • Conference_Location
    Vienna
  • ISSN
    1094-2734
  • Print_ISBN
    1-4244-0811-3
  • Electronic_ISBN
    1094-2734
  • Type

    conf

  • DOI
    10.1109/ICT.2006.331284
  • Filename
    4133317