Title :
Multi-step three dimensional micro assembly for a flexible LED display
Author :
Chiou, Yu-Ruei ; Huang, Shih-Ya ; Wang, Kerwin
Author_Institution :
Nat. Changhua Univ. of Educ., Changhua, Taiwan
Abstract :
This paper presents a novel multi-step three dimensional microassembly of passive-circuit-mesh, conductive beads, and LED chips to fabricate a flexible, bright, and wide viewing angle display. A novel flexible display architecture is proposed. To deliver this design, we focus our efforts on the multi-batch assembly integration. A 3-by-3 light-emitting diode array with a chip size of 610 ¿m by 610 ¿m by 90 ¿m is successfully prototyped with device fill factor up to 37.97%. It yields a 990 ¿m squared monochromatic pixel.
Keywords :
LED displays; microassembling; conductive beads; flexible LED display; flexible display architecture; light-emitting diode array; multibatch assembly integration; multistep three dimensional microassembly; passive-circuit-mesh; squared monochromatic pixel; Aluminum; Assembly; Circuits; Electrodes; Gold; Light emitting diodes; Liquid crystal displays; Packaging; Three dimensional displays; Wire;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
Conference_Location :
Wanchai, Hong Kong
Print_ISBN :
978-1-4244-5761-8
Electronic_ISBN :
1084-6999
DOI :
10.1109/MEMSYS.2010.5442567
