• DocumentCode
    2013602
  • Title

    Dielectric microwave characterization of the SU-8 thick resin used in an above IC process

  • Author

    Ghannam, Ayad ; Viallon, Christophe ; Bourrier, David ; Parra, Thierry

  • Author_Institution
    LAAS, Univ. of Toulouse, Toulouse, France
  • fYear
    2009
  • fDate
    Sept. 29 2009-Oct. 1 2009
  • Firstpage
    1041
  • Lastpage
    1044
  • Abstract
    A broadband technique for determining electrical properties of dielectric materials is presented, based on microstrip lines. Relative permittivity and loss tangent are computed from S-parameter measurements and analytical equations. The analytical computation is either direct by using equations derived from Bahl formulas, or iterative by using Jensen-Hammerstad formulas coupled with the efficient secant algorithm. Thin film microstrip transmission lines have been fabricated for the extraction of dielectric electrical properties of SU-8 resin. A relative dielectric constant of 2.85 and a loss tangent of 0.04 were determined. These values are used in an EM simulator for the design of an SU-8 based high-Q inductor implemented on a low resistivity silicon substrate. The good agreement between measurements and simulations validates the characterization procedure and confirms the relevance of SU8 for applications up to 15 GHz.
  • Keywords
    alumina; dielectric losses; dielectric materials; microstrip lines; permittivity; polymers; transmission lines; Bahl formulas; IC process; Jensen-Hammerstad formulas; S-parameter measurements; SU-8 based high-Q inductor; SU-8 thick resin; analytical computation; analytical equations; broadband technique; dielectric constant; dielectric materials; dielectric microwave characterization; efficient secant algorithm; electromagnetic simulators; loss tangent; relative permittivity; thin film microstrip transmission lines; Dielectric loss measurement; Dielectric materials; Dielectric measurements; Dielectric substrates; Dielectric thin films; Equations; Microstrip; Microwave integrated circuits; Permittivity; Resins;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 2009. EuMC 2009. European
  • Conference_Location
    Rome
  • Print_ISBN
    978-1-4244-4748-0
  • Type

    conf

  • Filename
    5295989