Title :
Electronic Transport Properties of Te-doped CoSb3 Prepared by Encapsulated Induction Melting
Author :
Sin-Wook You ; Kwan-Ho Park ; Soon-Chul Ur ; Il-Ho Kim
Author_Institution :
Res. Center for Sustainable ECo-Devices & Mater., Chungju Nat. Univ., Chungbuk
Abstract :
Sn-doped CoSb3 skutterudites (CoSb3-ySny) were prepared by encapsulated induction melting and their electronic transport properties were investigated. Carrier concentration increased with increasing the Sn doping content and the Sn dopant could affect the electronic structure of CoSb3 and generate excess charge carriers (holes). However, carrier mobility decreased with increasing the doping content, which indicates that the hole mean free path was reduced by the impurity scattering. Seebeck coefficient decreased with increasing the carrier concentration. Electrical resistivity slightly decreased with increasing the carrier concentration because the carrier mobility was reduced by the impurity scattering as the carrier concentration increased. The lattice thermal conductivity was dominant in the Sn-doped CoSb3 skutterudites. Seebeck coefficient showed a positive value at all temperatures examined and it increased as the temperature increased. Sn-doped CoSb3 lies on the semimetallic range which confirms a highly degenerate semiconductor
Keywords :
Seebeck effect; cobalt compounds; degenerate semiconductors; electrical resistivity; hole density; hole mobility; impurity scattering; melting; semiconductor doping; thermal conductivity; tin; CoSb3:Sn; Seebeck coefficient; degenerate semiconductor; electrical resistivity; electronic transport; encapsulated induction melting; hole concentration; hole mobility; impurity scattering; semiconductor doping; skutterudites; thermal conductivity; Charge carriers; Doping; Electric resistance; Impurities; Induction generators; Lattices; Scattering; Temperature; Thermal conductivity; Tin;
Conference_Titel :
Thermoelectrics, 2006. ICT '06. 25th International Conference on
Conference_Location :
Vienna
Print_ISBN :
1-4244-0811-3
Electronic_ISBN :
1094-2734
DOI :
10.1109/ICT.2006.331310