DocumentCode :
2013734
Title :
Self-aligned Assembly Technology For Optical Devices Using AuSn Solder Bumps Flip-chip Bonding
Author :
Sasaki, J. ; Kaneyama, Y. ; Honmou, H. ; Itoh, M. ; Uji, T.
Author_Institution :
NEC Corporation
fYear :
1992
fDate :
16-19 Nov 1992
Firstpage :
260
Lastpage :
261
Keywords :
Assembly; Bonding; Diode lasers; Laboratories; Light emitting diodes; National electric code; Optical arrays; Optical devices; Optical waveguides; Stimulated emission;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
LEOS '92, Conference Proceedings. IEEE Lasers and Electro-Optics Society, 1992 Annual Meeting
Print_ISBN :
0-7803-0526-4
Type :
conf
DOI :
10.1109/LEOS.1992.693942
Filename :
693942
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2013734
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