DocumentCode
2013734
Title
Self-aligned Assembly Technology For Optical Devices Using AuSn Solder Bumps Flip-chip Bonding
Author
Sasaki, J. ; Kaneyama, Y. ; Honmou, H. ; Itoh, M. ; Uji, T.
Author_Institution
NEC Corporation
fYear
1992
fDate
16-19 Nov 1992
Firstpage
260
Lastpage
261
Keywords
Assembly; Bonding; Diode lasers; Laboratories; Light emitting diodes; National electric code; Optical arrays; Optical devices; Optical waveguides; Stimulated emission;
fLanguage
English
Publisher
ieee
Conference_Titel
LEOS '92, Conference Proceedings. IEEE Lasers and Electro-Optics Society, 1992 Annual Meeting
Print_ISBN
0-7803-0526-4
Type
conf
DOI
10.1109/LEOS.1992.693942
Filename
693942
Link To Document