DocumentCode :
2013943
Title :
Fabrications of Micro-Channel Device by Hot Emboss and Direct Bonding of PMMA
Author :
Mizuno, J. ; Harada, T. ; Glinsner, T. ; Ishizuka, M. ; Edura, T. ; Tsutsui, K. ; Ishida, H. ; Shoji, S. ; Wada, Y.
Author_Institution :
Waseda University
fYear :
2004
fDate :
25-27 Aug. 2004
Firstpage :
26
Lastpage :
29
Abstract :
We have fabricated and evaluated the mechanical, optical and fluidic characteristics a 50µm wide and a 30µm deep micro-channel device produced by hot emboss and direct bonding of PMMA plate with dimensions of 20mm × 20mm × 1mm. The fabricated micro-channel device was evaluated the bond strength, which was confirmed to be high enough for practical use as well as for quite severe cleaning conditions as ultrasonic cleaning in pure water. The optical loss around bonded interface was also evaluated and no increase in the light absorption was observed. The above results confirmed that the hot emboss and direct bonding technologies for micro-channel manufacturing using the PMMA plates realizes high performance micro channel devices.
Keywords :
Bonding; Fabrication; Micromechanical devices;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
MEMS, NANO and Smart Systems, 2004. ICMENS 2004. Proceedings. 2004 International Conference on
Print_ISBN :
0-7695-2189-4
Type :
conf
DOI :
10.1109/ICMENS.2004.1508907
Filename :
1508907
Link To Document :
بازگشت