Title :
Electronic packaging reliability in automotive applications
Author :
Winterbottom, W.L.
Author_Institution :
Ford Motor Co., Dearborn, MI, USA
Abstract :
The design methodology for reliable electronic packaging for automotive electronic applications is discussed. Sources of reliability problems are also discussed. Examples are given to illustrate the features of several key interconnects in hybrid, thick-film devices in which material selection and design are critical. Some examples of reliable design models are given
Keywords :
automotive electronics; packaging; reliability; automotive electronic applications; electronic packaging; hybrid devices; reliability; thick-film devices; Automobiles; Automotive applications; Automotive electronics; Automotive engineering; Automotive materials; Electronic packaging thermal management; Electronics packaging; Materials reliability; Power system reliability; Semiconductor diodes;
Conference_Titel :
Automotive Power Electronics, 1989
Conference_Location :
Dearborn, MI
DOI :
10.1109/APE.1989.97160
