DocumentCode
2014106
Title
Electronic packaging reliability in automotive applications
Author
Winterbottom, W.L.
Author_Institution
Ford Motor Co., Dearborn, MI, USA
fYear
1989
fDate
28-29 Aug 1989
Firstpage
79
Lastpage
83
Abstract
The design methodology for reliable electronic packaging for automotive electronic applications is discussed. Sources of reliability problems are also discussed. Examples are given to illustrate the features of several key interconnects in hybrid, thick-film devices in which material selection and design are critical. Some examples of reliable design models are given
Keywords
automotive electronics; packaging; reliability; automotive electronic applications; electronic packaging; hybrid devices; reliability; thick-film devices; Automobiles; Automotive applications; Automotive electronics; Automotive engineering; Automotive materials; Electronic packaging thermal management; Electronics packaging; Materials reliability; Power system reliability; Semiconductor diodes;
fLanguage
English
Publisher
ieee
Conference_Titel
Automotive Power Electronics, 1989
Conference_Location
Dearborn, MI
Type
conf
DOI
10.1109/APE.1989.97160
Filename
97160
Link To Document