DocumentCode :
2014148
Title :
Microstructure and thermoelectric properties of pulse-current sintered Fe2 VAl alloy
Author :
Mikami, M. ; Matsumoto, A. ; Kobayashi, K.
Author_Institution :
National Inst. of Adv. Ind. Sci. & Technol., Nagoya
fYear :
2006
fDate :
6-10 Aug. 2006
Firstpage :
524
Lastpage :
527
Abstract :
The Fe2VAl sintered alloy having fine microstructure was synthesized to evaluate the effect of grain size on thermoelectric properties. Fine powder was firstly prepared by the mechanical alloying. Secondly, to suppress the grain growth during heat treatment, the powder was rapidly sintered by the pulse-current sintering method. Bulk material consisting of grains with a size of 200-300 nm was obtained. Compared to the arc-melted sample consisting of grains with a size of 100-400 mum, the thermal conductivity was reduced by phonon scattering at grain boundaries. The modification of microstructure had little effect on the magnitude of Seebeck coefficient. Since the reduction of electrical conductivity by the increase of the number of grain boundaries was smaller than that of thermal conductivity, the thermoelectric figure of merit was improved
Keywords :
Seebeck effect; aluminium alloys; electrical conductivity; grain boundaries; grain size; iron alloys; phonon-impurity interactions; powders; sintering; thermal conductivity; vanadium alloys; Fe2VAl; Seebeck coefficient; electrical conductivity; grain boundary; grain size; heat treatment; mechanical alloying; microstructure; phonon scattering; pulse-current sintered alloy; pulse-current sintering method; thermal conductivity; thermoelectric merit figure; thermoelectric property; Alloying; Conducting materials; Grain boundaries; Grain size; Heat treatment; Iron alloys; Microstructure; Powders; Thermal conductivity; Thermoelectricity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermoelectrics, 2006. ICT '06. 25th International Conference on
Conference_Location :
Vienna
ISSN :
1094-2734
Print_ISBN :
1-4244-0811-3
Electronic_ISBN :
1094-2734
Type :
conf
DOI :
10.1109/ICT.2006.331348
Filename :
4133345
Link To Document :
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