Title :
Transient thermal impedance considerations in power semiconductor applications
Author :
Hopkins, T. ; Tiziani, R.
Author_Institution :
SGS-Thomson Microelectron., Phoenix, AZ, USA
Abstract :
Cost-effective thermal design in power switching applications must consider the effect of thermal impedance of the packaging. A test method is presented for determining the transient thermal impedance of a package. Empirical measurements of the thermal impedance of some standard plastic packages, showing the effective thermal impedance under pulsed conditions, are also given. As an example of a practical application of the data presented, an application for switching motor control is considered
Keywords :
packaging; power transistors; cost-effective thermal design; packaging; power semiconductor applications; power switching; pulsed conditions; standard plastic packages; switching motor control; transient thermal impedance; Impedance; Integrated circuit packaging; Plastic integrated circuit packaging; Plastic packaging; Power semiconductor switches; Pulse measurements; Resistance heating; Semiconductor device packaging; Temperature; Thermal resistance;
Conference_Titel :
Automotive Power Electronics, 1989
Conference_Location :
Dearborn, MI
DOI :
10.1109/APE.1989.97162
