Title :
Resonance absorption in the surface wave plasma
Author :
Omaru, T. ; Komiyama, F. ; Kogoshi, S.
Author_Institution :
Dept. of Electr. Eng., Tokyo Univ. of Sci., Chiba, Japan
Abstract :
Summary form only given, as follows. A planar surface wave plasma (SWP) has been expected to be one of the next generation plasma sources for processing and extensively studied. Why the efficiency of the energy absorption is so good and as the results high density plasma is sustained, are still not clear. It is said that the oscillating Efield of the surface wave parallel to the density gradient would resonantly excite electrons plasma waves and then waves produce high energy electrons that are responsible for high density plasma production. We call it a resonant absorption model in SWP. In order to investigate the resonant absorption model PIC-MCC simulations have been done The PIC-MCC code (XPDP1) developed by the California University group is modified to include an evanescently oscillating E-field and used. The decay constant of the E-field is determined from the E-field distributions calculated from FDTD method. As a result, it has been shown that the electrostatic waves observed in the simulation are electron plasma waves, and the waves may produce high energy electrons, which may sustain a high density plasma. The high efficient energy absorption comes from the resonant conversion from electromagnetic waves to electron plasma waves and the large effective collision frequency.
Keywords :
plasma electrostatic waves; plasma simulation; plasma sources; PIC-MCC simulation; XPDP1; electron plasma waves; electrostatic waves; resonance absorption; surface wave plasma; Absorption; Electrons; Plasma density; Plasma materials processing; Plasma simulation; Plasma sources; Plasma waves; Production; Resonance; Surface waves;
Conference_Titel :
Plasma Science, 2003. ICOPS 2003. IEEE Conference Record - Abstracts. The 30th International Conference on
Conference_Location :
Jeju, South Korea
Print_ISBN :
0-7803-7911-X
DOI :
10.1109/PLASMA.2003.1228743