• DocumentCode
    2014261
  • Title

    Microwave power performance on AlGaN/GaN HEMTs on composite substrate

  • Author

    De Jaeger, Jean-Claude ; Hoel, Virginie ; Defrance, Nicolas ; Douvry, Yannick ; Gaquiere, Christophe ; Di Forte-Poisson, Marie-Antoinette ; Thorpe, James ; Lahreche, Hacene ; Langer, Robert

  • Author_Institution
    IEMN (Inst. d´´Electron., de Microelectron. et de Nanotechnol.), Univ. Lille1, Villeneuve-d´´Ascq, France
  • fYear
    2009
  • fDate
    28-29 Sept. 2009
  • Firstpage
    144
  • Lastpage
    147
  • Abstract
    In this paper, microwave power performance at 10 GHz of HEMTs fabricated on MOCVD and MBE epitaxial structures grown on composite substrates is demonstrated. These substrates, based on monocrystalline-SiC layer on a polycrystalline-SiC (SiCopSiC), are engineered using the Smart Cuttrade technology. They are based on innovative engineering in which a thin SiC single crystal layer is transferred on top of a thick polycrystalline SiC wafer with a thin SiO2 intermediary insulating layer. The process used for the devices fabrication on SiCopSiC is quite similar to those on SiC monocrystalline bulk developed previously. High power density was measured on both epi-materials at 10 GHz. Regarding the power results for the components based on MOCVD epi-material, the best value is an output power density of 5.06 W/mm associated to a PAE of 34.7% and a linear gain of 11.8 dB at VDS = 30 V. In the frame of the MBE epilayer, the output power density is 3.58 W/mm with a maximum PAE of 25% and a linear gain around 15 dB at VDS = 40 V.
  • Keywords
    III-V semiconductors; MOCVD coatings; aluminium compounds; gallium compounds; microwave field effect transistors; microwave power transistors; molecular beam epitaxial growth; power HEMT; silicon compounds; wide band gap semiconductors; AlGaN-GaN; HEMT; MBE epitaxial structure; MOCVD; SiC; Smart Cut technology; epi-materials; frequency 10 GHz; gain 11.8 dB; intermediary insulating layer; microwave power transistor; thick polycrystalline silicon carbide wafer; voltage 30 V; Aluminum gallium nitride; Gallium nitride; HEMTs; MOCVD; MODFETs; Molecular beam epitaxial growth; Power engineering and energy; Power generation; Silicon carbide; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Integrated Circuits Conference, 2009. EuMIC 2009. European
  • Conference_Location
    Rome
  • Print_ISBN
    978-1-4244-4749-7
  • Type

    conf

  • Filename
    5296015