DocumentCode :
2014336
Title :
Characterization of oxide-incorporated n-type Mg2Si prepared by a spark plasma sintering method
Author :
Nemoto, T. ; Akasaka, M. ; Iida, T. ; Sato, J. ; Nishio, K. ; Takei, T. ; Takanashi, Y.
Author_Institution :
Nippon Thermostat Co. Ltd., Kiyose-shi
fYear :
2006
fDate :
6-10 Aug. 2006
Firstpage :
552
Lastpage :
555
Abstract :
Mg2Si and Mg2Si incorporating oxides such as Al2O3, ZrO2, SnO2, ZnO, B 2O3 and CuO were formed by using a spark-plasma sintering (SPS) technique. The "oxide-incorporated" Mg2Si samples exhibited the formation of voids and also clusters of oxide materials. The effects of oxide incorporation into Mg2Si were investigated in an attempt to identify oxides that exhibit lower thermal conductivity but an equal power factor and figure-of-merit when compared with pure Mg2Si. In the cases of the samples of Mg2Si that incorporated SnO2, ZnO, ZrO2 and Al2O3, the observed power factors showed no significant temperature dependence, with values comparable to those observed for pure Mg2Si at about 2 times 10-5 W/cmK2. The incorporation of SnO2 or ZnO improved the lattice thermal conductivity over the whole measured temperature range when compared with a pure Mg2Si sample. The observed deviations in the values of the figures-of-merit between the SnO2 or ZnO-incorporated Mg2Si and the pure Mg2Si (without the oxide) were observed as being rather small, with no remarkable dissidence in the measured values. It was realized that the SnO2- and the ZnO-incorporated Mg2Si samples exhibited thermal conductivity values that were more than 20 % lower than that of pure Mg2Si at around 773 K
Keywords :
alumina; boron compounds; copper compounds; magnesium compounds; narrow band gap semiconductors; silicon compounds; sintering; thermal conductivity; thermoelectric power; tin compounds; voids (solid); zinc compounds; zirconium compounds; Mg2Si-Al2O3; Mg2Si-B2O3; Mg2Si-CuO; Mg2Si-SnO2; Mg2Si-ZnO; Mg2Si-ZrO2; merit figure; oxide materials; power factor; spark plasma sintering method; thermal conductivity; void formation; Conducting materials; Lattices; Plasmas; Reactive power; Sparks; Temperature dependence; Temperature measurement; Thermal conductivity; Thermal factors; Zinc oxide;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermoelectrics, 2006. ICT '06. 25th International Conference on
Conference_Location :
Vienna
ISSN :
1094-2734
Print_ISBN :
1-4244-0811-3
Electronic_ISBN :
1094-2734
Type :
conf
DOI :
10.1109/ICT.2006.331355
Filename :
4133352
Link To Document :
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