Title :
Submicron Mechanically Planarized Shallow Trench Isolation With Field Shield
Author :
Linderiberger, W.S. ; Kornblit, A. ; Lai, W. ; Hillenius, S.J. ; Chen, M.-L.
Author_Institution :
AT&T Bell Laboratories, PA
Keywords :
Breakdown voltage; Circuit testing; Dielectrics; Dry etching; Fabrication; Hydrogen; Printing; Resists; Silicides; Silicon;
Conference_Titel :
VLSI Technology, 1991. Digest of Technical Papers., 1991 Symposium on
Conference_Location :
Oiso, Japan
DOI :
10.1109/VLSIT.1991.706004
