Title :
Numerical optimization of high frequency properties of vias and bends in MCM-L technology
Author :
Cyrusian, S. ; Moghaddam, M. Vakilzadeh
Author_Institution :
Res. Center for Microperipheric, Tech. Univ. Berlin, Germany
Abstract :
High frequency performance of chip-to-chip interconnections is primarily limited by the structure of chip mounting, vias and bends. The last two problems are investigated by full wave simulation technique. A great performance improvement is achieved
Keywords :
multichip modules; MCM-L technology; bends; chip mounting; chip-to-chip interconnections; full wave simulation technique; high frequency properties; vias; Capacitance; Costs; Frequency; Impedance; Magnetic field measurement; Nonhomogeneous media; Reflection; Signal analysis; Wiring; Workstations;
Conference_Titel :
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-2411-0
DOI :
10.1109/EPEP.1994.594054
