DocumentCode :
2014986
Title :
Mechanical and Thermoelectric Performance of p-type Bi-Sb-Te Prepared by Hot Pressing
Author :
Wu, Xiaofeng ; Xu, Guiying ; Xu, Yadong ; Zhang, Chunyan ; Ge, Changchun
Author_Institution :
Lab. of Special Ceramics & Powder Metall., Univ. of Sci. & Technol. Beijing
fYear :
2006
fDate :
6-10 Aug. 2006
Firstpage :
652
Lastpage :
655
Abstract :
P-type (Sb2Te3)75(Bi2Te3 )25+xTe (x = 2, 3, 4, 5, wt %) was prepared by single-axis hot pressing. The performances of the samples were reported and discussed in this paper. SEM was made to observe the typical microstructure. Density and bending strength were observed for analyzing the dependence of content of telluride on strength. Electric conductivity and Seebeck coefficient were measured, power factor was calculated, and telluride dependence of thermoelectric properties was analyzed. By analysis, we found that there were evident relation among content of telluride dependence of morphology, density, bending strength and thermoelectric properties. Power factor of Bi-Sb-Te doped with 4wt% telluride was the highest, with alpha = 0.209mV7K, sigma = 90.253(Omega-mm)-1, alpha2sigma =3.951 mW/K 2middotm
Keywords :
Seebeck effect; antimony compounds; bending strength; bismuth compounds; crystal microstructure; electrical conductivity; hot pressing; scanning electron microscopy; semiconductor materials; (Sb2Te3)75(Bi2Te 3)25; Bi-Sb-Te; SEM; Seebeck coefficient; bending strength; crystal density; crystal microstructure; electric conductivity; hot pressing; mechanical property; morphology; thermoelectric performance; Bismuth; Conductivity measurement; Electric variables measurement; Microstructure; Morphology; Power measurement; Pressing; Reactive power; Tellurium; Thermoelectricity; Bi-Sb-Te; hot pressing; p-type; performance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermoelectrics, 2006. ICT '06. 25th International Conference on
Conference_Location :
Vienna
ISSN :
1094-2734
Print_ISBN :
1-4244-0811-3
Electronic_ISBN :
1094-2734
Type :
conf
DOI :
10.1109/ICT.2006.331226
Filename :
4133378
Link To Document :
بازگشت