DocumentCode :
2015
Title :
Defect Engineering Using Bilayer Structure in Filament-Type RRAM
Author :
Daeseok Lee ; Jiyong Woo ; Euijun Cha ; Sangsu Park ; Sangheon Lee ; Jaesung Park ; Hyunsang Hwang
Author_Institution :
Dept. of Mater. Sci. & Eng., Pohang Univ. of Sci. & Technol., Pohang, South Korea
Volume :
34
Issue :
10
fYear :
2013
fDate :
Oct. 2013
Firstpage :
1250
Lastpage :
1252
Abstract :
To develop a low-power and stable resistive RAM, a defect engineering using bilayer structure is proposed. To control the amount of defect in switching layer, interfacial state between an oxygen absorption layer and switching layer is used. Therefore, in low-power operation, defect engineered sample demonstrated the proposed approach based on its improved ON/OFF ratio and stability.
Keywords :
absorption; circuit stability; low-power electronics; random-access storage; bilayer structure; circuit stability; defect engineering; filament-type RRAM; improved ON-OFF ratio; interfacial state; low-power RAM; oxygen absorption layer; stable resistive RAM; switching layer; Absorption; Hafnium compounds; Random access memory; Reliability; Resistance; Switches; Bilayer; defect engineering; interface engineering; low-power operation; resistive random access memory (RRAM);
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2013.2279009
Filename :
6594832
Link To Document :
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