• DocumentCode
    2015068
  • Title

    Mechanical Properties of the Interface between Nickel Contact and Extruded (Bi1-xSbx)2(Te1-ySey)3 Thermoelectric Materials

  • Author

    Vasilevskiy, D. ; Roy, F. ; Renaud, E. ; Masut, R.A. ; Turenne, S.

  • Author_Institution
    Ecole Polytechnique de Montreal, Que.
  • fYear
    2006
  • fDate
    6-10 Aug. 2006
  • Firstpage
    666
  • Lastpage
    669
  • Abstract
    We present detailed studies of the mechanical behavior of electrical contacts since they have a strong effect on the performance and long term reliability of thermoelectric (TE) modules both for cooling and electricity generation. We have studied the mechanical properties of electroplated and electroless plated Ni contacts on n-type and p-type (Bi1-xSbx)2(Te1-ySey )3 polycrystalline quaternary alloys. These alloys were obtained by mechanical alloying followed by hot extrusion. A variety of surface preparation methods and metallization processes were applied and compared. As soldering alloys we used Sn(60%)Pb(40%) or Sn(95%)Sb(5%) on top of the Ni contacts. Our results show that it is possible to reach mechanical strength above 350 kg/cm2 when proper metallization and soldering technologies are applied. Contact reliability becomes especially important for short-legged modules, which provide higher density of cooling and generating power. Extruded TE materials may be the only ones suitable for devices where the required mechanical stress is very high
  • Keywords
    alloying; antimony compounds; bismuth compounds; extrusion; interface phenomena; mechanical strength; metallisation; nickel; semiconductor-metal boundaries; soldering; thermoelectric devices; (Bi1-xSbx)2(Te1-ySe y)3; Ni; Sn-Pb; Sn-Sb; contact interface; electrical contacts; hot extrusion; mechanical alloying; mechanical property; mechanical strength; mechanical stress; metallization process; nickel; polycrystalline quaternary alloys; soldering alloys; soldering technology; surface preparation method; thermoelectric materials; thermoelectric modules; Bismuth; Contacts; Cooling; Mechanical factors; Metallization; Nickel alloys; Power generation; Soldering; Tellurium; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2006. ICT '06. 25th International Conference on
  • Conference_Location
    Vienna
  • ISSN
    1094-2734
  • Print_ISBN
    1-4244-0811-3
  • Electronic_ISBN
    1094-2734
  • Type

    conf

  • DOI
    10.1109/ICT.2006.331229
  • Filename
    4133381