Title :
2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual (Cat. No.00CH37059)
Abstract :
The following topics were dealt with: dielectrics; hot carriers; MEMS; device and process reliability; packaging; compound semiconductors; electrostatic discharge; interconnects; process induced damage; failure analysis
Keywords :
dielectric thin films; electrostatic discharge; failure analysis; hot carriers; integrated circuit interconnections; integrated circuit reliability; micromechanical devices; semiconductor device packaging; semiconductor device reliability; semiconductor technology; MEMS; compound semiconductors; dielectrics; electrostatic discharge; failure analysis; hot carriers; interconnects; packaging; process induced damage; process reliability; reliability physics;
Conference_Titel :
Reliability Physics Symposium, 2000. Proceedings. 38th Annual 2000 IEEE International
Conference_Location :
San Jose, CA, USA
Print_ISBN :
0-7803-5860-0
DOI :
10.1109/RELPHY.2000.843882
