Title :
Reliability characterization of thermal micro-structures implemented on 0.8 μm CMOS chips
Author :
Sheng, L.Y. ; De Tandt, C. ; Ranson, W. ; Vounckx, R.
Author_Institution :
IMEC Electron. Div., Brussels Univ., Belgium
Abstract :
This paper discusses the reliability characterization of thermal microstructures implemented on industrial 0.8 μm CMOS chips. Various degradation and failure mechanisms are identified and evaluated under high temperature operation. The results can be used to optimize the design of thermally based microsensors on CMOS chips
Keywords :
CMOS integrated circuits; integrated circuit reliability; microsensors; 0.8 mum; CMOS chips; failure mechanisms; high temperature operation; microsensors; reliability; thermal microstructures; CMOS technology; Calibration; Degradation; Electrical resistance measurement; Passivation; Resistance heating; Resistors; Temperature measurement; Temperature sensors; Voltage;
Conference_Titel :
Reliability Physics Symposium, 2000. Proceedings. 38th Annual 2000 IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-5860-0
DOI :
10.1109/RELPHY.2000.843900
