Title :
Effects of metal-plasma source ion implantation on the adhesion strength of DLC film
Author :
Jin-Woo Yi ; Jong-Kuk Kim ; Eungsun Byon ; Sik Chol Kwon ; Seock-Sam Kim
Author_Institution :
Korea Inst. of Machinery & Mater., Changwon, South Korea
Abstract :
Summary form only given, as follows. Diamond-like carbon(DLC) films are of considerable research interests because of their widespread applications as protective coatings in areas such as magnetic storage disks, biomaterial coatings and as micro-electromechanical devices(MEMs). Although DLC films have been considered as a strong candidate for various applications due to its excellent mechanical properties, their poor adhesion on tool steels limits the applications. In order to overcome this drawback, some ideas were introduced. Recently, ion implantation was used to improve the adhesion between thin film and substrate. In this work, we investigated effect of ion implantation on the adhesion strength of DLC film as a function of ion doses and implanted energies. Ti and W ions were implanted on the Si-wafer and WC-Co substrates, then DLC films were deposited by ion beam deposition method. A CSEM-REVETEST scratch tester was used to assess the adhesion characteristics. From results, the adhesion strength of films was improved as increasing ion implantation energy, however there was no significant change with ion dose. Further results, including morphology and compositional variation at the different ion energies and doses, will be presented.
Keywords :
adhesion; diamond-like carbon; ion beam assisted deposition; ion implantation; surface morphology; titanium; tungsten; C:Ti; C:W; CSEM-REVETEST scratch tester; DLC film; MEMs; Si; WC-Co; adhesion strength; biomaterial coatings; compositional variation; implanted energies; ion doses; magnetic storage disks; mechanical properties; metal-plasma source ion implantation; morphology; poor adhesion; protective coatings; tool steels; Adhesives; Coatings; Ion implantation; Magnetic films; Magnetic memory; Mechanical factors; Protection; Steel; Substrates; Transistors;
Conference_Titel :
Plasma Science, 2003. ICOPS 2003. IEEE Conference Record - Abstracts. The 30th International Conference on
Conference_Location :
Jeju, South Korea
Print_ISBN :
0-7803-7911-X
DOI :
10.1109/PLASMA.2003.1228798