DocumentCode :
2016028
Title :
The Grid Enablement and Sustainable Simulation of Multiscale Physics Applications
Author :
Song, Yingwen ; Tanaka, Yoshio ; Takemiya, Hiroshi ; Nakano, Aiichiro ; Ogata, Shuji ; Sekiguchi, Satoshi
Author_Institution :
Nat. Inst. of Adv. Ind. Sci. & Technol., Tsukuba
fYear :
2009
fDate :
18-21 May 2009
Firstpage :
100
Lastpage :
107
Abstract :
The understanding of H diffusion in materials is pivotal to designing suitable processes. Though a nudged elastic band (NEB)+molecular dynamics (MD)/quantum mechanics (QM) algorithm has been developed to simulate H diffusion in materials by our group, it is often not computationally feasible for large-scale models on a conventional single system. We thus gridify the NEB+MD/QM algorithm on the top of an integrated framework developed by our group. A two days simulation on H diffusion in alumina has been successfully carried out over a trans-pacific grid infrastructure consisting of supercomputers provided by TeraGrid and AIST. In this paper, we describe the NEB+MD/QM algorithm, briefly introduce the framework middleware, present the grid enablement work, and report the techniques to achieve fault-tolerance and load-balance for sustainable simulation. We believe our experience is of benefit to both middleware developers and application users.
Keywords :
grid computing; middleware; physics computing; quantum theory; H diffusion; fault-tolerance; framework middleware; grid enablement; load-balance; molecular dynamics; multiscale physics applications; nudged elastic band; quantum mechanics; sustainable simulation; trans-pacific grid infrastructure; Computational modeling; Computer industry; Fault tolerance; Grid computing; Large-scale systems; Materials science and technology; Middleware; Physics computing; Quantum computing; Quantum mechanics; Fault Tolerence; Grid Enablement; Large Scale Computation; Load Balance; Long Time Computation; MD/QM+NEB; TeraGrid;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Cluster Computing and the Grid, 2009. CCGRID '09. 9th IEEE/ACM International Symposium on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-3935-5
Electronic_ISBN :
978-0-7695-3622-4
Type :
conf
DOI :
10.1109/CCGRID.2009.33
Filename :
5071860
Link To Document :
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