DocumentCode :
2016222
Title :
ESD robustness of smart-power protection structures evaluated by means of HBM and TLP tests
Author :
Meneghesso, G. ; Santirosi, S. ; Novarini, E. ; Contiero, C. ; Zanoni, E.
Author_Institution :
Dipt. di Elettronica e Inf., Padova Univ., Italy
fYear :
2000
fDate :
2000
Firstpage :
270
Lastpage :
275
Abstract :
In this paper we will present data concerning the ESD robustness of smart power protection structures (fabricated in Bipolar, CMOS, DMOS, BCD technology) for input-output circuits. A comparison between the robustness of “p-body” and “p-well” based structures and a study of the influence of layout parameters on the ESD robustness will be given. The correlation between ESD robustness obtained with different test methods (HBM and TLP) will be also presented. Failure analysis has been carried out by means of SEM device cross-sections
Keywords :
electrostatic discharge; failure analysis; integrated circuit testing; power integrated circuits; protection; scanning electron microscopy; ESD robustness; HBM test; SEM device cross-section; TLP test; failure analysis; input-output circuit; smart power protection structure; Biological system modeling; CMOS technology; Circuits; Electrostatic discharge; Leakage current; Protection; Robustness; Semiconductor device modeling; Testing; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 2000. Proceedings. 38th Annual 2000 IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-5860-0
Type :
conf
DOI :
10.1109/RELPHY.2000.843926
Filename :
843926
Link To Document :
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