• DocumentCode
    2016472
  • Title

    Electromigration lifetime enhancement for lines with multiple branches

  • Author

    Dion, Michael J.

  • Author_Institution
    Intersil Corp., Melbourne, FL, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    324
  • Lastpage
    332
  • Abstract
    With clock or power supply interconnect “trees” there is often a very high current “trunk” feeding current to multiple branches. This work demonstrates and discusses increased “trunk” lifetime with increasing numbers of current branches in a plug-via metal system. The branches act as reservoirs or sources of additional Al and Cu ions, which can re-fill portions of voids and/or slow void growth. It is discussed that any area of metal at a lower current density might be considered a reservoir or source of metal ions for higher current density regions, and can effectively extend the lifetime of the higher current density region. Comparative Black´s model parameters are developed and failure analysis is described
  • Keywords
    current density; electromigration; failure analysis; integrated circuit interconnections; Black´s model; current density; electromigration lifetime; interconnect trees; multiple branches; plug-via metal system; trunk lifetime; void growth; Clocks; Conductors; Current density; Electromigration; Electrons; Failure analysis; Industrial relations; Power supplies; Power system interconnection; Reservoirs;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2000. Proceedings. 38th Annual 2000 IEEE International
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    0-7803-5860-0
  • Type

    conf

  • DOI
    10.1109/RELPHY.2000.843934
  • Filename
    843934