DocumentCode :
2016540
Title :
Quantum multiscale modeling of electron dynamics and material properties during femtosecond laser-material interactions
Author :
Zheng Xie ; Cong Wang ; Zhi Luo ; Ji´an Duan ; Lan Jiang
Author_Institution :
State Keoy Lab. of High Performance Complex Manuf., Central South Univ., Changsha, China
fYear :
2015
fDate :
11-14 Aug. 2015
Firstpage :
1
Lastpage :
7
Abstract :
The controlled, well-characterized evolution of the amplitude envelope and carrier-frequency sweep of ultrafast laser pulses permits measurement and control of quantum transitions on a femtosecond time scale. This opens new perspectives for controlling the transient localized electron dynamics, corresponding material properties and phase change mechanisms, which are critical in laser micro/nano fabrication. In this study, the first-principles calculations and plasma model are used to theoretically investigate the changes of localized transient electron dynamics and the corresponding material properties during femtosecond laser pulse trains ablation of fused silica. Theoretical results show that the electron dynamics including photon absorption, electron excitation and free electron distributions can be changed; the corresponding material properties such as thermal and optical properties can then be controlled; and hence, high quality structures can be obtained.
Keywords :
ab initio calculations; high-speed optical techniques; laser ablation; silicon compounds; SiO2; electron excitation; femtosecond laser pulse train ablation; femtosecond laser-material interactions; first-principles calculations; free electron distributions; fused silica; localized transient electron dynamics; material properties; optical properties; photon absorption; plasma model; quantum multiscale modeling; thermal properties; Atom optics; Atomic beams; Chemicals; Dielectrics; Electron optics; Mechanical factors; Ultrafast optics; electron dynamics; laser micro/nano fabrication; laser-material interactions; quantum multiscale modelling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location :
Changsha
Type :
conf
DOI :
10.1109/ICEPT.2015.7236531
Filename :
7236531
Link To Document :
بازگشت