Title :
Experimental data and statistical models for bimodal EM failures
Author :
Fischer, A.H. ; Abel, A. ; Lepper, M. ; Zitzelsberger, A.E. ; von Glasow, A.
Author_Institution :
Reliability Methodology, Infineon Technol. AG, Munich, Germany
Abstract :
The correct model for the electromigration failure distribution is a key issue in reliability methodology. Usually, the failure times of a sample are fitted by a single log-normal distribution. However, in some cases relevant deviations can be found. In this paper two types of non-log-normal distributions observed on via-line structures are discussed. They can be modeled by two types of bimodal distributions, each composed of two log-normal distributions. Both models consider different failure mechanisms within the sample or specimen. Experimental data sets coinciding with either model will be presented. The physical failure analysis confirms the model assumptions and supports the bimodal distribution concept
Keywords :
electromigration; failure analysis; integrated circuit interconnections; integrated circuit reliability; bimodal distributions; bimodal electromigration failures; electromigration failure distribution; nonlog-normal distributions; reliability; via-line structures; Current density; Electromigration; Equations; Failure analysis; Grain boundaries; Integrated circuit interconnections; Log-normal distribution; Shape; Temperature distribution; Testing;
Conference_Titel :
Reliability Physics Symposium, 2000. Proceedings. 38th Annual 2000 IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-5860-0
DOI :
10.1109/RELPHY.2000.843940