• DocumentCode
    2016646
  • Title

    Experimental data and statistical models for bimodal EM failures

  • Author

    Fischer, A.H. ; Abel, A. ; Lepper, M. ; Zitzelsberger, A.E. ; von Glasow, A.

  • Author_Institution
    Reliability Methodology, Infineon Technol. AG, Munich, Germany
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    359
  • Lastpage
    363
  • Abstract
    The correct model for the electromigration failure distribution is a key issue in reliability methodology. Usually, the failure times of a sample are fitted by a single log-normal distribution. However, in some cases relevant deviations can be found. In this paper two types of non-log-normal distributions observed on via-line structures are discussed. They can be modeled by two types of bimodal distributions, each composed of two log-normal distributions. Both models consider different failure mechanisms within the sample or specimen. Experimental data sets coinciding with either model will be presented. The physical failure analysis confirms the model assumptions and supports the bimodal distribution concept
  • Keywords
    electromigration; failure analysis; integrated circuit interconnections; integrated circuit reliability; bimodal distributions; bimodal electromigration failures; electromigration failure distribution; nonlog-normal distributions; reliability; via-line structures; Current density; Electromigration; Equations; Failure analysis; Grain boundaries; Integrated circuit interconnections; Log-normal distribution; Shape; Temperature distribution; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2000. Proceedings. 38th Annual 2000 IEEE International
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    0-7803-5860-0
  • Type

    conf

  • DOI
    10.1109/RELPHY.2000.843940
  • Filename
    843940