Title :
Reliability of direct mesa flip-chip bonded VCSELs
Author :
Teitelbaum, M. ; Goossen, K.W.
Author_Institution :
Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA
Abstract :
We have demonstrated flip chip bonded vertical cavity surface emitting lasers (VCSELs) that have been bonded directly to the mesa. We have seen that flip chip bonding to the mesa has given lowered thermal impedance compared to side flip-chip and die bonded VCSELs. An array of devices has been run for 1600 hours without failure.
Keywords :
bonding processes; flip-chip devices; laser reliability; semiconductor laser arrays; surface emitting lasers; 1600 hour; VCSEL; direct mesa flip-chip bonding; reliability; thermal impedance; Bonding; Flip chip; Impedance; Life estimation; Life testing; RNA; Stress; Surface emitting lasers; Temperature; Vertical cavity surface emitting lasers;
Conference_Titel :
Lasers and Electro-Optics Society, 2004. LEOS 2004. The 17th Annual Meeting of the IEEE
Print_ISBN :
0-7803-8557-8
DOI :
10.1109/LEOS.2004.1363243
