• DocumentCode
    2016703
  • Title

    Preparation and thermo-mechanical properties of functionalized graphene/silicone rubber nanocomposites

  • Author

    Zong, Yangyang ; Gui, Dayong ; Li, Shibin ; Tan, Guiming ; Xiong, Weijian ; Liu, Jianhong

  • Author_Institution
    School of Chemistry and Chemical Engineering, Shenzhen University, Guangdong 518060, China
  • fYear
    2015
  • fDate
    11-14 Aug. 2015
  • Firstpage
    30
  • Lastpage
    34
  • Abstract
    Silicone rubber is widely used in electronic packaging materials. Electronic appliances have become miniaturized which need more outstanding packaging materials. Functionalized grapheme/scilicon rubber composites is one of the development to improve the performance of the silicone rubber. Graphite oxide (GO) was modified by KH-550, and then the modified graphite oxide was reduced by hydrazine hydrate to get functionalized graphene (FG). In order to get functionalized graphene /silicon rubber nanocomposites, FG was dispersed into 107 gum. The structure and morphology of both the nanocomposites and FG were characterized by FTIR, SEM, XRD and TG. The results show that KH-550 was bonded with GO, the layer of FG was expanded to 0.4nm. Compared with the pure silicon rubber, the initial decomposition temperature of all the functionalized graphene/silicon rubber nanocomposites were improved. Mechanical property tests show that the tensile strength of the nanocomposites with 0.7wt% FG are 2.46 MPa which increases by 198.39% compared with neat silicone rubber, and the elongation at break of composite increases by 171.89%, which is about triple of the pure silicone rubber. Thermal conductivity test shows that the thermal conductivity of the composites with 1.0wt% FG reaches 0.18 W /(m·K).
  • Keywords
    Graphene; Nanocomposites; Rubber; Silicon; Thermal conductivity; Ultrasonic variables measurement; graphene; mechanical properties; nanocomposites; silicone rubber; thermal properties;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
  • Conference_Location
    Changsha, China
  • Type

    conf

  • DOI
    10.1109/ICEPT.2015.7236538
  • Filename
    7236538