Title :
A strategy to analyze soft reliability issues detected by Iddq measurements
Author :
Osterreicher, I. ; Nowak, C. ; Eckl, S. ; Tippelt, B. ; Werner, W.
Author_Institution :
Dresden GmbH & Co. OHG, Dresden
Abstract :
This paper first explains how this algorithm is applied to reject as many suspicious parts as possible and not throwing away any good parts at the same time. The most interesting question for the failure analyst will be answered in the main part: What kind of defects, if any, can be found on the rejected (but functional) chips, that could have an impact on reliability? The failure analysis flow based on devices failing the delta IDDQ test is shown and a variety of physical defects that can be found with this method is presented. In addition the benefit for physical failure analysis will be explained.
Keywords :
circuit reliability; failure analysis; logic circuits; logic testing; Iddq measurements; physical failure analysis; soft reliability issues;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2007. IPFA 2007. 14th International Symposium on the
Conference_Location :
Bangalore
Print_ISBN :
978-1-4244-1014-9
DOI :
10.1109/IPFA.2007.4378056