Title :
Improvement of Au adhesion on parylene-c and SiO/sub 2/ substrates using oxygen plasma treatment
Author :
Lee, J.H. ; Hwang, K.S. ; Yoon, K.H. ; Kim, T.S. ; Ahn, Seungyoung
Author_Institution :
Mcrosystem Res. Center, KIST, Seoul, South Korea
Abstract :
Summary form only given, as follows. Parylene-c (Pa-c) film is a pinhole-free barrier against moisture, chemical and biofluid. So it is candidate for low dielectric materials for the application of biosensors such as DNA and protein chip Pa-c and SiO/sub 2/ films are deposited on a Si substrate using a vapor deposition method and LPCVD, respectively. Au was then deposited on both substrates using the e-beam evaporation method. For improvement of Au adhesion on Pa-c and SiO/sub 2/ surfaces, surface modification of Pa-c and SiO/sub 2/ was performed using oxygen plasma. Pa-c and SiO/sub 2/ layers were exposed to an oxygen plasma using a reactive ion etcher at various power and times.
Keywords :
adhesion; gold; plasma CVD coatings; plasma deposition; silicon compounds; Au; Au adhesion; LPCVD; SiO/sub 2/; SiO/sub 2/ substrates; e-beam evaporation method; parylene-c; vapor deposition; Adhesives; Biosensors; Chemicals; DNA; Dielectric materials; Dielectric substrates; Gold; Moisture; Plasma applications; Proteins;
Conference_Titel :
Plasma Science, 2003. ICOPS 2003. IEEE Conference Record - Abstracts. The 30th International Conference on
Conference_Location :
Jeju, South Korea
Print_ISBN :
0-7803-7911-X
DOI :
10.1109/PLASMA.2003.1228851
