DocumentCode
2017383
Title
A study of strain gage test during PCB assembly process
Author
Zou, Yabing ; Xiao, Hui
Author_Institution
Reliability Research and Analysis Center, China Ceprei Laboratory, Guangzhou, China
fYear
2015
fDate
11-14 Aug. 2015
Firstpage
136
Lastpage
139
Abstract
Stress-induced solder joint failure is one of the most common modes of printed circuit board assembly (PCBA) failures. Various assembly and test processes can cause solder joint failures on PCBAs by over-flexing them even before they are shipped out. This paper will discuss the strain gage test method, the test procedure and the typical application.
Keywords
Films; Instruments; Joints; Monitoring; Soldering; Strain; Substrates; Hazardous Process Discrimination; PCB Assembly; Strain Gage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location
Changsha, China
Type
conf
DOI
10.1109/ICEPT.2015.7236560
Filename
7236560
Link To Document