Title :
Reliability Challenges in Analog and Mixed Signal Technologies
Author :
Chaparala, P. ; Brisbin, D. ; Jonggook Kim ; OConnell, Barry
Author_Institution :
Nat. Semicond. Corp., Santa Clara
Abstract :
Unique analog product application requirements such as high speed, low noise, low power, high precision and high voltage demand complex analog process technologies. This complexity poses several reliability challenges that are specific to each technology. In this paper some of the key reliability mechanisms in most common analog process technologies are highlighted. To meet broad range of analog IC reliability requirements, in-depth device reliability characterization is essential besides the traditional process reliability qualification.
Keywords :
analogue integrated circuits; integrated circuit reliability; mixed analogue-digital integrated circuits; analog IC reliability; analog process technologies; in-depth device reliability; mixed signal technologies; reliability mechanisms; Analog circuits; CMOS technology; Circuit testing; Degradation; Digital circuits; Human computer interaction; Niobium compounds; Paper technology; Threshold voltage; Titanium compounds;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2007. IPFA 2007. 14th International Symposium on the
Conference_Location :
Bangalore
Print_ISBN :
978-1-4244-1014-9
DOI :
10.1109/IPFA.2007.4378073
